#Rosin flux vs Pc#

#Rosin flux vs Pc#

As the solder melts, the solder begins to boil and absorb heat, thus keeping the temperature of the electronic components and PCB at this temperature.ģ.Applicable to the mobile phone, PC board and other precision electronic chip level welding.

Improve efficiency and speed up the welding process, with less time to let the solder flow to where you need to provide more controllable and accurate welding.Ģ.The boiling point is slightly higher than the melting point of the solder. No clean flux can be used with organic solvent or water.Solder flux paste leaves a protective coating in the welding area to prevent corrosion. This varnished layer can be eliminated by heated organic solvents baths. Of the product thermal inertia a complete polymerization can occur before liquidus temperature is reached. If temperature ramp up is too slow because On another hand the time/temperature process window is very sharp. In addition Dry extract is less than 5% compared to more than 15%usually, as a consequence it is barely visible. That is the reason why in theory it is not required to clean.

This electrically insulating varnished layer prevent the flux to spread, contaminate and corrode the electronic board and components. This flux form after heating a varnished layer consequence of polymerization reaction between doil ( vehicle ) and diacid ( activators ). Those residues come primarily from a reaction between the activators and the vehicles. Those flux let a controlled amount of residues on the top of the component and theoretically require no post cleaning. Thus they generally impose an intense cleaning with hot water. They are in general more aggressive than rosin because they are more acid. it is necessary to well control pre-heating to avoid the boiling. The principal solvent are water or a water/alcohol mixture. These flux are made with some organic or carboxylic. It is necessary to know the activation temperature of the activators and their aggressiveness degree which will influence the cleaning process after soldering. To improve the activity of these flows, activators are added. The melting point of rosin is located between 125 and 130 ☌. The most used resin is the rosin, which is made with resin of pine ( 90% resin acids and 10% ester ). They are surfactants, rheological agents, thermal stabilizers …Īs a rule a flux is a solid which has been dissolved by a solvent. They allow to improve an existing function of flux. The solvents evaporate during the preheat. Their role is to fluidize the activators and the vehicles at the ambient temperature and allow to spread uniformly the flux to the precise place of soldering. They create a heat exchange and allow a fast and homogeneous heat transfer towards surface being soldered. They protect cleaned surface and prevent re-oxidation. Vehicle consist in solid or/and non volatile liquid.Īt the soldering temperature, they dissolve, residues of de-oxidation reaction. However, aggressive fluxes contain strong acids, mineral acids, amines and halides, but of course due to ecological reasons flux manufacturer are going toward others solutions ( halide free…). The higher index acid is, the flux activation is stronger. This index corresponds to the mass of KOH to neutralize 1 gram acid present in the residues of flux. This information is always given on the technical file. The activity degree is directly related to acid index of flux. Oxides according to the following reaction : Thus these are the activators which attack Glutaric acid, whose boiling points exceed 300 ☌. The main organic acids used in flux are adipic acid, citric acid and In general and currently, the principal activators are carboxylic acids, which are added to rosin